UVtransfer product image
UVtransfer product image



A unique 3-in-1 system for MicroLED process development and pilot line use, that performs Laser Lift-Off (LLO), Laser-Induced Forward Transfer (LIFT), and pixel repair/trimming.

UVtransfer provides the automation, precision, and throughput to move hundreds of millions of dies for large displays and enables their economic viability. High-throughput results from our powerful excimer lasers that are long-proven in the display industry for LTPS annealing.

UVtransfer - Overview

The system is built on a granite motion module that delivers unmatched precision, and is powered by a high-energy 248 nm UV laser for high-throughput using large field sizes.

Product Specifications

Key Feature Benefit
3-in-1 Multifunctionality Investigate, optimize, and validate three processes with a single investment.
Large fields sizes – up to 16 x 2 mm2 High throughput.
Supports all die sizes, from 50 down to 5 µm Future-proof technology.
Proven excimer laser source Eliminates technical risks.
Deep UV Compatible with all die materials.
User-friendly software automation Easy to setup and optimize without extensive training.



• Display