
Large Format Polysilicon Annealing
The demand for high definition and power efficient low-temperature polysilicon (LTPS) display backplanes is rising to be the foremost differentiator for mobile devices such as smartphones and tablets. LineBeam systems are the enabling technology for mass manufacturing of LTPS backplanes on large substrate panels with the highest yield.
308 nm excimer laser annealing enables market growth of faster, brighter, thinner and more lightweight AM-LCD and AM-OLED flat panel devices relying on high electron mobility.
LineBeam Model | LineBeam 750
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LineBeam 1000
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LineBeam 1300
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LineBeam 1500
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Wavelength (nm) | 308
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308
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308
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308
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Line Beam Length (mm) | 750
|
1000
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1300
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1500
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Beam Profile Type | Top-hat along both axes
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Top-hat along both axes
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Top-hat along both axes
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Top-hat along both axes
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Depth of Focus (µm) | ±150
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±120
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±120
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±120
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LineBeam Key Features |
308 nm wavelength for high yield OLED and LCD polysilicon annealing |
Superior pulse stability and high depth of field to ensure a large process window |
Short and long axis beam homogeneity for maximum throughput and beam utilization |
Proven performance in leading large-scale OLED and LCD fabs |